205 Results

manufacturing

Search

Intel’s Technology Tour in Arizona unveiled their groundbreaking 18A process, revolutionizing semiconductor capabilities for upcoming Core Ultra series and Xeon processors. Through advancements like RibbonFET and PowerVia, Intel enhances VoIP solutions, ensuring better efficiency and connectivity. Industry investments underscore Intel’s strategic push in the U.S. semiconductor race.

Foxconn and TECO’s strategic share-swap alliance is set to revolutionize the AI infrastructure market by leveraging Foxconn’s expertise in AI server production and TECO’s prowess in industrial systems. Their collaboration aims to provide modular AI data center solutions globally, aligning with evolving market demands for scalable and sustainable infrastructure.