In a recent unveiling, Qualcomm announced the introduction of the Snapdragon 8s Gen 3 chipset, poised to revolutionize a range of smartphones from brands such as Honor, iQOO, realme, Redmi, and Xiaomi in the upcoming months. This cutting-edge chip is designed to democratize premium features for a broader audience, previously exclusive to high-end models, by incorporating select advanced capabilities directly from its flagship Snapdragon 8 Gen 3 series.
Nokia unveiled specialized, private AI models for the telecom sector to improve network operations and customer service. A coalition of 10 governments agreed on principles for secure 6G networks. IBM and the GSMA have launched a global AI training initiative to bridge the AI knowledge gap among telecom operators. Qualcomm’s Snapdragon X80 modem chip introduces 5G-Advanced support with up to 10 Gbps speeds and six-carrier aggregation.
In a recent announcement, chip manufacturer Qualcomm has introduced the latest iteration of its immersive technology, the Snapdragon XR2+ Gen 2. Boasting advancements in mixed reality (MR) and virtual reality (VR), the new chipset is set to power future VR innovations from tech giants Samsung and Google.
Just under a year ago, the tech world buzzed with anticipation over a new partnership between chip mogul Qualcomm and satellite firm Iridium. The aim? Integrating satellite-to-phone services via Snapdragon Satellite and Iridium’s resources. However, a recent shift in direction caught the industry’s attention. Despite a successful demo, smartphone manufacturers didn’t opt to incorporate this feature, leading Qualcomm to end the agreement. Yet, in the face of disappointment, Iridium remains optimistic, envisaging an industry veering towards greater satellite connectivity. As earthquakes ripple across the telecoms landscape, all eyes await what’s next.
Dish’s recent announcement differentiates them as the first operator to amalgamate both 2 uplink and 4 downlink 5G carriers, reaching compelling speeds with such configuration. Despite skepticism around Open RAN’s performance, Dish continues to silence critics and signifies an exciting possibility for future network builds.
DISH Wireless, in partnership with Samsung and Qualcomm, has achieved groundbreaking 5G carrier aggregation milestones. Notably, peak uplink speeds of 200 Mbps and 1.3 Gbps downlink speeds were realized with minimal spectrum usage, marking a significant advance in 5G capabilities. Boost Mobile subscribers can anticipate faster download and upload speeds.
Diving deeper into spatial computing realms, Qualcomm releases Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 platforms, enhancing user immersion through improved GPU performance, AI, and concurrent camera capabilities. Snapdragon XR2 aims at efficient virtual reality navigation while AR1 offers advanced features for smart glasses. However, despite the technological leap, the mass-market embrace of AR/VR innovations stays at bay. The question remains: will Qualcomm’s efforts be enough to spur the demand boost the industry awaits?
Apple’s pursuit of self-reliance in 5G technology is put to the test as it continues its reliance on Qualcomm’s Snapdragon 5G Modem‑RF Systems till 2026. Despite acquiring Intel’s modem segment after a failed business collaboration, Apple’s efforts to create an in-house 5G modem cast doubt on its separation from Qualcomm. The competition intensifies with Huawei’s claim of a successful 5G modem design, amidst the encroaching discussions on 6G technology.
Qualcomm and Samsung recently announced a pioneering success in telecommunications; achieving dual uplink and quadruple downlink carrier aggregation for 5G FDD spectrum. This innovation, tested using Qualcomm’s Snapdragon X75 5G Modem-RF System with Samsung’s 5G radios, could provide operators increased flexibility. This trial demonstrates the potency of Advanced 5G modems in enhancing 5G connections, hinting exciting future developments in 5G. Commercial implementations of these findings are expected by late 2023.
In a monumental collaboration, Qualcomm and AWS aim to connect vehicles with the cloud, reshaping the future of automotive industry. Through this partnership, they offer auto companies the ability to fine-tune advanced vehicle software through cloud before installation. An integral part of this innovation is the Snapdragon Digital Chassis portfolio, which includes enhanced safety and infotainment systems.
