MediaTek has unveiled the Dimensity 9400, a powerful chipset built on TSMC’s 3nm process, delivering up to 40% better power efficiency and 35% faster single-core performance. Targeting edge-AI applications, it supports Wi-Fi 7, tri-fold smartphones, and advanced 5G connectivity.
Intel has announced a significant delay in constructing new chip manufacturing facilities in Germany and Poland, following disappointing Q2 financial results. This delay could impact Europe’s ambitions to bolster semiconductor production and reduce dependence on Chinese manufacturing.
Huawei is revolutionizing the wrist-worn device market, especially in China, by bucking global trends and achieving significant growth. With a 42% year-on-year increase in shipments, Huawei leads thanks to strategic market expansion and robust domestic performance.
Tower Semiconductor and Adani Group are collaborating to build a $10 billion chip facility in Maharashtra, India. This ambitious project aims to boost domestic production of analog circuits and wafers, with initial output set at 40,000 wafers per month. Once fully operational, the plant will create over 5,000 jobs and enhance India’s semiconductor market presence.
Qualcomm has launched the Snapdragon 4s Gen 2, an affordable 5G chipset designed to boost its market presence. Featuring a Gigabit-capable modem but fewer high-end features, it’s aimed at budget-friendly 5G smartphones. Qualcomm’s new chip targets a growing market of cost-conscious consumers, with Xiaomi set to release the first device using the new platform.
After more than two years of declines, the European smartphone market has started to show signs of recovery, with a 10% year-on-year increase in shipments during the first quarter of 2024, according to Counterpoint Research. However, analysts are cautious about predicting a significant long-term upswing.
Apple is venturing into the realm of artificial intelligence (AI) processing chips for data centers, as reported by the Wall Street Journal. This move positions Apple in direct competition with industry peers like Google and Amazon, which have already heavily invested in AI chip technology.
HMD, the company behind Nokia phones, has unveiled its inaugural lineup of self-branded smartphones known as the Pulse series. This move marks a significant departure for HMD, which initially gained traction by leveraging the trusted Nokia name for its handset operations.
At the recent Embedded World event, Qualcomm, the US mobile chip giant, has introduced a new wifi System-on-Chip (SoC) named the QCC730 Wi-Fi solution. This innovative chip boasts an impressive 88% reduction in power consumption compared to previous equivalents, making it a game-changer for battery-powered IoT (Internet of Things) devices.
At Enterprise Connect, Cisco (NASDAQ: CSCO) today unveiled new purpose-built, multifunctional devices that deliver modernized collaboration experiences to today’s hybrid workforce. The company announced the launch of the Cisco Board Pro G2, an AI-fueled and touch-enabled collaboration device and Cisco Desk Phone 9800 Series, designed to bring a modern and personalized productivity hub to any desk.
