In a significant development for commuters, the Berlin underground (U-Bahn) has finalized the installation of a 4G mobile network, ensuring high-speed internet access across its entire subway system. The initiative, a collaboration between Germany’s O2 Telefonica and Berliner Verkehrsbetriebe (BVG), marks a milestone achievement after years of planning and execution. Data usage among subway users has skyrocketed, increasing sevenfold since 2019, necessitating improved connectivity underground.
In response to the escalating demand for cloud services across public and private sectors in Italy, TIM, the leading telecommunications provider, has announced a strategic collaboration with Oracle. This partnership aims to integrate Oracle Cloud Infrastructure (OCI) into TIM’s managed cloud services, marking a significant step towards meeting Italy’s evolving cloud requirements.
In a landmark agreement, Microsoft and Brookfield, an asset management company, have announced a renewable energy deal valued at an estimated $10 billion. Under this partnership, Microsoft will invest in energy projects developed by Brookfield and its renewable energy subsidiary.
Fujitsu Limited and Oracle have joined forces to introduce innovative cloud and AI capabilities tailored to the digital sovereignty needs of Japanese enterprises and government agencies. This collaboration focuses on leveraging Oracle Alloy to enhance Fujitsu’s Hybrid IT offerings, particularly its Fujitsu Uvance platform designed to assist clients in business growth and societal problem-solving.
China’s telecommunication landscape is set for a potential paradigm shift as the Ministry of Industry and Information Technology (MIIT) pilots a novel scheme to alleviate foreign ownership constraints in various value-added telecom services. Primarily trialed in Beijing, Shanghai, Hainan, and Shenzhen, this bold change could stimulate innovation by aligning these industries with global trade norms.
With a hefty $6.6 billion subsidy by the U.S. government, Taiwan Semiconductor Manufacturing Co (TSMC) embarks on an unprecedented development in semiconductor industry. This boost is not only expected to foster job creation with an estimate of up to 6,000 high-tech positions but also promises to democratize access to advanced technologies.
NEC Corporation (NEC; TSE: 6701) and NTT Corporation (NTT) today announced that they have successfully conducted a first-of-its-kind transoceanic-class 7,280km transmission experiment using a coupled 12-core multicore fiber (*1), which consists of 12 optical signal transmission paths in a standard outer diameter optical fiber (0.125 mm). This achievement is expected to be a next-generation transmission infrastructure technology that will contribute to the realization of large-capacity optical networks, including future optical submarine cables.
In a significant move aimed at reducing its hefty debt, Altice has decided to offload its French media operations to the maritime giant CMA CGM for €1.55 billion. The deal, structured as a cash transaction, sees CMA CGM acquiring an 80% share, while the remaining 20% goes to Merit France, a holding company related to the shipping group. This strategic sale encompasses Altice Media, the parent company of the well-regarded news channel BFM and RMC, a radio broadcaster.
Arelion and Telxius are collaborating to provide fully diverse, multi-terabit connectivity into Telxius’ landing stations in Boca Raton and Jacksonville, Florida. This fiber network expansion establishes Arelion Points-of-Presence (PoPs) at each Telxius landing station. For Telxius, it empowers customers with resilient Tier-1 optical transport and high-speed access to Arelion’s North American network. Together, Arelion and Telxius are making a significant investment in the Florida Peninsula to connect Latin American customers to North America through submarine and terrestrial systems.
In a major development, AI semiconductor giant SAPEON is partnering with DOCOMO Innovations to boost AI services. Their focus ranges from Large Language Models to computer vision AI applications. The collaboration will leverage SAPEON’s latest AI semiconductor, the X330, expected to revolutionize sectors including finance and health. The high-performing X330 not only doubles its predecessor’s power efficiency but permits enhanced operations like voice recognition and automated responses.
