Qualcomm has launched the Snapdragon 4s Gen 2, an affordable 5G chipset designed to boost its market presence. Featuring a Gigabit-capable modem but fewer high-end features, it’s aimed at budget-friendly 5G smartphones. Qualcomm’s new chip targets a growing market of cost-conscious consumers, with Xiaomi set to release the first device using the new platform.
Vertiv has unveiled the Vertiv MegaMod CoolChip, an innovative liquid cooling system integrated into a prefabricated modular (PFM) data center solution. Designed for AI computing, the MegaMod CoolChip accelerates the deployment of AI-critical infrastructure by up to 50%. This system offers scalability and high-density cooling, providing efficient solutions for AI compute providers.
The US government has taken a significant step by revoking specific licenses that allow American chip manufacturers to export goods to Huawei, the Chinese tech giant. This action will notably reduce the sales of major chip producers like Intel and Qualcomm to China.
Apple is venturing into the realm of artificial intelligence (AI) processing chips for data centers, as reported by the Wall Street Journal. This move positions Apple in direct competition with industry peers like Google and Amazon, which have already heavily invested in AI chip technology.
At the recent Embedded World event, Qualcomm, the US mobile chip giant, has introduced a new wifi System-on-Chip (SoC) named the QCC730 Wi-Fi solution. This innovative chip boasts an impressive 88% reduction in power consumption compared to previous equivalents, making it a game-changer for battery-powered IoT (Internet of Things) devices.
With a hefty $6.6 billion subsidy by the U.S. government, Taiwan Semiconductor Manufacturing Co (TSMC) embarks on an unprecedented development in semiconductor industry. This boost is not only expected to foster job creation with an estimate of up to 6,000 high-tech positions but also promises to democratize access to advanced technologies.
A research team led by Professor Wang Cheng from the Department of Electrical Engineering (EE) at City University of Hong Kong (CityUHK) has developed a world-leading microwave photonic chip that is capable of performing ultrafast analog electronic signal processing and computation using optics.
Exploring Apple’s groundbreaking leap in silicon innovation with their latest M3, M3 Pro, and M3 Max products, it’s evident that personal computer processing is being redefined. Promising substantially expedited rendering times and performance enhancements across the board, Apple offers these not as mere upgrades, but as game-changers in the hardware world. Furthermore, these innovations signal noteworthy shifts in the broader landscape of PC CPU chips, traditionally dominated by Intel and AMD, now facing exciting competition. Dive deeper to discover the impact of these changes in the world of technology.
Nvidia, the graphics processing unit heavyweight, plans to enter Intel’s domain with ARM-based chips tailor-made for Windows PCs, according to insiders. AMD, another significant player in this space, is also reportedly considering ARM technology. This move, potentially hitting the market by 2025, has been stimulated by Microsoft’s interest in duplicating the efficiency of Apple’s ARM-use in AI processing. Yet, Nvidia’s past attempt to acquire ARM was thwarted by regulators, putting the company’s motives under scrutiny as the PC CPU sector braces for potential disruption.
Vodafone’s collaboration with Salience Labs and iPronics aims to advance open radio access networks (open RAN) by harnessing the potential of silicon photonic chips. This light-based technology could promise enhanced network programmability and ultra-low latency powered by their increased speed and reduced energy consumption — elevating critical 5G capabilities. With silicon photonics making waves in data centers, the industry, poised for rapid growth, radiates intrigue on the horizon. Yet, it also questions current cost dynamics, especially around open RAN technology.
