Qualcomm’s acquisition of Sequans Communications’ 4G IoT technology marks a significant leap in enhancing their VoIP solutions for the industrial IoT market. By integrating Sequans’ specialized cellular semiconductor solutions, Qualcomm aims to offer more reliable and optimized VoIP connectivity. This strategic move bolsters their portfolio, aligning with the growing demand for robust IoT connections.
Qualcomm has launched the Snapdragon 4s Gen 2, an affordable 5G chipset designed to boost its market presence. Featuring a Gigabit-capable modem but fewer high-end features, it’s aimed at budget-friendly 5G smartphones. Qualcomm’s new chip targets a growing market of cost-conscious consumers, with Xiaomi set to release the first device using the new platform.
The Snapdragon X Plus is an upgraded version of the Snapdragon X Elite, which debuted in October last year. Many of the touted features remain similar, including claims of exceptional performance, extended battery life, and cutting-edge on-device AI capabilities. Qualcomm asserts that the CPU, GPU, and NPU (Neural Processing Unit) collectively offer superior performance and energy efficiency.
At the recent Embedded World event, Qualcomm, the US mobile chip giant, has introduced a new wifi System-on-Chip (SoC) named the QCC730 Wi-Fi solution. This innovative chip boasts an impressive 88% reduction in power consumption compared to previous equivalents, making it a game-changer for battery-powered IoT (Internet of Things) devices.
In a recent unveiling, Qualcomm announced the introduction of the Snapdragon 8s Gen 3 chipset, poised to revolutionize a range of smartphones from brands such as Honor, iQOO, realme, Redmi, and Xiaomi in the upcoming months. This cutting-edge chip is designed to democratize premium features for a broader audience, previously exclusive to high-end models, by incorporating select advanced capabilities directly from its flagship Snapdragon 8 Gen 3 series.
Nokia unveiled specialized, private AI models for the telecom sector to improve network operations and customer service. A coalition of 10 governments agreed on principles for secure 6G networks. IBM and the GSMA have launched a global AI training initiative to bridge the AI knowledge gap among telecom operators. Qualcomm’s Snapdragon X80 modem chip introduces 5G-Advanced support with up to 10 Gbps speeds and six-carrier aggregation.
In a recent announcement, chip manufacturer Qualcomm has introduced the latest iteration of its immersive technology, the Snapdragon XR2+ Gen 2. Boasting advancements in mixed reality (MR) and virtual reality (VR), the new chipset is set to power future VR innovations from tech giants Samsung and Google.
Just under a year ago, the tech world buzzed with anticipation over a new partnership between chip mogul Qualcomm and satellite firm Iridium. The aim? Integrating satellite-to-phone services via Snapdragon Satellite and Iridium’s resources. However, a recent shift in direction caught the industry’s attention. Despite a successful demo, smartphone manufacturers didn’t opt to incorporate this feature, leading Qualcomm to end the agreement. Yet, in the face of disappointment, Iridium remains optimistic, envisaging an industry veering towards greater satellite connectivity. As earthquakes ripple across the telecoms landscape, all eyes await what’s next.
Dish’s recent announcement differentiates them as the first operator to amalgamate both 2 uplink and 4 downlink 5G carriers, reaching compelling speeds with such configuration. Despite skepticism around Open RAN’s performance, Dish continues to silence critics and signifies an exciting possibility for future network builds.
DISH Wireless, in partnership with Samsung and Qualcomm, has achieved groundbreaking 5G carrier aggregation milestones. Notably, peak uplink speeds of 200 Mbps and 1.3 Gbps downlink speeds were realized with minimal spectrum usage, marking a significant advance in 5G capabilities. Boost Mobile subscribers can anticipate faster download and upload speeds.
