Nine European nations have formed the “Semicon Coalition” to strengthen the continent’s semiconductor industry. The initiative, launched in Brussels, focuses on research, development, and production, aiming for self-sufficiency amid rising global investments.
Microsoft has unveiled its first quantum chip, Majorana 1, powered by a breakthrough material called a topoconductor. This innovation enables topological superconductivity, paving the way for a million-qubit quantum system.
Apple’s iPhone C1 modem chip marks a major shift in reducing reliance on Qualcomm, targeting an 80% cut by 2026. The 4nm modem, debuting in the iPhone 16e, enhances network performance but lacks mmWave 5G.
Nokia has unveiled a groundbreaking 5G-enabled Nokia 360 Camera designed for Industry 4.0 applications. Featuring immersive 8K streaming and connectivity via 5G, Wi-Fi, and Ethernet, this camera blends cutting-edge virtual reality capabilities with robust durability.
Ookla’s analysis of the iPhone 16 reveals improved 5G performance over its predecessors in several regions, including the U.S. and Canada, where speeds surpassed 324 Mbps. However, Samsung’s Galaxy S24 excelled in latency and upload speeds.
The launch of the world’s highest-capacity UltraSMR and ePMR CMR hard disk drives by Western Digital marks a pivotal advancement in data storage, offering up to 32TB of robust storage solutions. With their innovative technologies enhancing efficiency and reliability, these new HDDs are tailored to meet the demands of hyperscalers and cloud providers.
T-Mobile US and TCL have unveiled a revolutionary 5G RedCap USB-C dongle, the TCL LINKPORT IK511, in North America. Utilizing the Snapdragon X35 5G Modem-RF System, it delivers impressive speeds up to 220Mb/s.
AMD’s new 5th Gen EPYC processors, “Turin,” featuring the Zen 5 core architecture, significantly enhance data center performance for enterprise, AI, and cloud applications. With models like the EPYC 9575F offering a 28% speed boost and up to 5GHz, AMD leads in energy-efficient, powerful solutions for AI and virtualized infrastructures.
MediaTek has unveiled the Dimensity 9400, a powerful chipset built on TSMC’s 3nm process, delivering up to 40% better power efficiency and 35% faster single-core performance. Targeting edge-AI applications, it supports Wi-Fi 7, tri-fold smartphones, and advanced 5G connectivity.
Intel has announced a significant delay in constructing new chip manufacturing facilities in Germany and Poland, following disappointing Q2 financial results. This delay could impact Europe’s ambitions to bolster semiconductor production and reduce dependence on Chinese manufacturing.
