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Intel and Samsung Boost vRAN Technology: Examining the Impact

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US tech giant Intel and South Korean conglomerate Samsung have recently reaffirmed their commitment to advance the virtualized Radio Access Network (vRAN) technology. This move makes perfect sense for both parties. Intel, an undisputed leader in providing general-purpose silicon solutions, aims to push as many RAN processes into this realm. On the other hand, Samsung, a notable player in the technology sector, aims to bridge the gap with established RAN vendors, making vRAN a compelling alternative to traditional RAN technology.

Beginning their synergistic relationship in 2017, vRAN was but an emerging idea in the collective conscience of the telecom industry. Central to this newly announced collaboration is the integration of Samsung’s vRAN 3.0 software with Intel’s robust 4th generation Xeon Scalable processors. This marks more of a rejuvenation, rather than a departure, of the dynamic relationship shared by the two companies.

Reflecting on the venture, Cristina Rodriguez, GM of the Wireless Access Networking division at Intel stated, “The mobile industry is on a transformational journey toward end-to-end network virtualization.” Enthusiasm radiates from this partnership, as the two tech giants join forces to accelerate the deployment of operators’ vRAN on a larger scale, with the key deliverables being adaptability, robust performance and energy efficiency.

Samsung’s Head of Technology Strategy Group, Networks Business, Jeongho Park expressed his excitement over Samsung’s expanding collaboration with Intel. Park highlighted the strategic partnership’s goal of powering vRAN’s future enhancements, which incorporates reduced power consumption, automation and increased flexibility.

In line with their meticulous approach, both Intel and Samsung conducted successful interoperability tests before publicizing their continuing partnership. Their joint product, a testament to mutual satisfaction, is expected to be available commercially before year’s end.

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